2019 Workshop Programme

Practical workshop sessions hosted by key exhibitors are held in three workshop theatres on the show floor to support your professional development. All content has been approved and accredited for CPD points by the IED.

Once you have registered you will be prompted to book your preferred sessions so you can tailor your visit to meet your personal learning and interest requirements.



10:30 - 11:15

Workshop Theatre 1

Next Generation 3D CAD from Siemens

Room: Workshop Theatre 1

Kevin Moran, Senior Applications Engineer, Siemens PLM Software

During this presentation, Kevin will discuss and show the benefits of Solid Edge’s Next Generation Design tools, with use Cases covering topics in Generative Design, Reuse of CAD data, Reverse Engineering, Augmented & Virtual Reality and Additive Manufacturing.

During this session delegates will learn:

1. How to digitize the design-to-manufacturing process with the Solid Edge 2020 Product Portfolio

2. What is “Solid Edge Next Generation Design”?

3. How can Next Generation Design work for me?

Workshop Theatre 2

Defining High Speed Signal Paths in modern PCB

Room: Workshop Theatre 2

Sten Inversen, Field Application Engineer, Altium

With ever-increasing device switching speeds comes the challenge of maintaining the integrity of the signal, and meeting timing requirements. The signal integrity can be managed through controlled impedance routing, which is achieved through careful design of both the PCB stack-up and routing widths.

The timing requirements are met by matching the routed lengths of the signal paths. For a set of 2-pin signal paths, calculating and comparing the lengths is a straightforward process. This is not the case for many typical designs though, where there may be a series termination component, and more than 2 pins in the signal path.

 During this session delegates will learn:

1. Impedance controlled PCB stack-up and Back drill vias using Altium Layer stack manager.

2. Length matching using Altium X-signal.

3. Technology aware length matching Wizard in Altium.

Workshop Theatre 3

Optimizing Engineering Designs with Multiphysics Simulation

Room: Workshop Theatre 3

Dr Richard Chippendale, Technical Manager, COMSOL

Numerical simulations allow us to directly visualize physical processes occurring within products. This provides an insight into the interaction of otherwise invisible phenomena, such as the movement of heat or mechanical stress.

During the early stages of product design, you will tend to have significant freedom within a given design envelope. With numerical simulation tools you can efficiently and systematically investigate this design envelope to create an optimized product. This could be achieved by changing the dimensions, shape, or form of the design, to minimize material use for example; or by considering different, cheaper materials, or even by simulating and optimizing the manufacturing process to minimize defects in the end product.

 During this session delegates will learn:
1. How to optimize engineering designs using Optimization module within the COMSOL Multiphysics® software

2. How simulation workflow can be generalized to many branches of physics and engineering

3. How the optimized geometry can be exported for further analysis and 3D printing

11:30 - 12:15

Workshop Theatre 1

Design Optimisation

Room: Workshop Theatre 1

Vishal Sharma, Senior Application Engineer, ANSYS UK

Topology optimisation, a technique used to generate free-form geometries is explored in this session. Additive Manufacturing (3D Printing) is gaining traction in the manufacturing industry, we will explore the opportunities this brings, but also the challenges. We’ll learn how simulation assisted design can help tackle these problems and produce components that are lightweight but strong enough to withstand the most rigorous of conditions.

During this session delegates will learn:

1. What topology optimisation is

2. Different optimisation techniques

3. How to run a topology optimisation in ANSYS

4. How to validate optimised designs

Workshop Theatre 2

Implementing Disruptive Mid-Infrared Technologies in Gas Sensing Applications

Room: Workshop Theatre 2

Adnan Quazi, Sales Engineer, Hamamatsu Photonics

Indium Arsenide Antimonite detectors provide an exciting new prospect for being able to detect gas species in various scenarios. However with any new technology, understanding how to properly implement it is necessary to be able to get the maximum value. We will highlight the flaws of looking at D* as a measure of sensitivity and instead focus on Signal to Noise Ratio.
We will focus on demystifying the electronic differences in this type of photo-voltaic detector technology. How it may be used in conjunction with different mid-infrared sources (LEDs and Quantum Cascade Lasers) and tips and tricks to maximise SNR.

During this session delegates will learn:

1. InAsSb Detectors, MIR LEDs and QCLs: Technology Overview

2. InAsSb Detectors, MIR LEDs and QCLs: Market comparison

3. The different operational modes of InAsSb. When to use which.

4. Why D* does not tell the full story and how to appreciate SNR

5. Tips and tricks to improve SNR with InAsSb Detectors.

Workshop Theatre 3

Samtec Products for Severe Environments

Room: Workshop Theatre 3

Terry Emerson, Micro Rugged & Power Product Manager, SAMTEC

Discussion on Samtec products designed to be used in severe environments and the methods used to prove they are capable of withstanding them.  We will also delve into Samtec’s Micro Rugged product line and discuss different options for interconnects and cables to solve system design obstacles.

During this session delegates will learn:

1. How Samtec tests our products to prove they can withstand severe environments.

2. What products can be used in severe environments.

3. How Samtec products can help with complex design obstacles.

12:30 - 13:15

Workshop Theatre 1

Marketing and Social media in China

Room: Workshop Theatre 1

Gordon Wong, Director, Techworks Asia

Claire Walker, Director, Techworks Asia

The opportunities to penetrate the Greater China market are plentiful and financially attractive for tech companies. Whether you have an established infrastructure in China, or are still looking to start targeting this vast market, this session will look at key trends and drivers and provide insights into which marketing initiatives work best in the fast-moving tech sector. We’ll look at how a marketing programme needs to harness both traditional and social key influencers to deliver messaging to its audience across the region, and analyse which approaches work most effectively. Particular focus will be made on the electronics design sector.

During this session delegates will learn:

1. How best to engage with key China media and influencers.

2. Why social media is vital for B2B in China.

3. What PR and marketing approaches to avoid.

4. What rewards are available for tech companies willing to commit to a long-term plan.

5. How best to align with the China Government’s key high-level technology target sectors and strands.

Workshop Theatre 2

Create Effective Cooling Solutions Using SOLIDWORKS® Flow Simulation and the 3DEXPERIENCE® Platform

Room: Workshop Theatre 2

Mattias Robertsson, Senior Solution Consultant, Simulation, Dassault Systemes

Ian Pilkington, 3DExperience Senior Business Development Executive, Dassault Systemes

With SOLIDWORKS® Flow Simulation engineers can virtually test designs to assess effectiveness of their cooling solution directly in the 3D CAD model. SOLIDWORKS dedicated thermal management study simulation tools enable accurate thermal analysis of electronic PCB and enclosure design. Using SOLIDWORKS Simulation, engineers can reduce noise, choose and test different cooling options and save time and money instead of building multiple prototypes and conducting thermal camera studies. Cloud-based 3DEXPERIENCE® platform allows companies to integrate all pieces of the product development lifecycle - from design to simulation and manufacturing - into one seamless workflow to enable better-connected teams and more-agile processes.

During this session delegates will learn:

1. Virtually test CAD models, speed up innovation and reduce time to market with SOLIDWORKS Simulation

2. Easily visualise and solve thermal design requirements with SOLIDWORKS Flow Simulation

3.  Remove heat and noise from electronics and optimize their designs

4.  Seamlessly collaborate with all key stakeholders using the 3DEXPERIENCE® platform

Workshop Theatre 3

On-Device AI with Qualcomm Snapdragon

Room: Workshop Theatre 3

Dominik Bohn, Business Development Manager , BCD-Atlantik Ltd

Artificial Intelligence and Artificial Neural Networks require complex software algorithms and extremely high computational power, this is covered with the increased performance of the latest Snapdragon products.

The latest Snapdragon products have an internal Neural Processing Engine (SNP), which brings a significant performance boost over the pure calculation in the CPU / GPU via parallelization of the calculations. Corresponding software, such as Dronecode, Robot Operating System or the Snapdragon Neural Processing Engine SDK now allow companies with limited development resources to deploy these technologies and execute trained AI models on their devices, without the need for a cloud connection (edge computing).

During this session delegates will learn:

1. Comparison of on-device AI and Cloud AI

2. Hardware: Power and Efficiency considerations 

3. AI Tools for development and deployment

4. System Efficiency and Reliability considerations

13:30 - 14:15

Workshop Theatre 1

Why thermal simulation is a must for electronics design

Room: Workshop Theatre 1

Tom Gregory, Product Manager , 6SigmaET from Future Facilities

There are so many things to consider when designing a PCB, from signal integrity to Design for manufacture. Thermal management can often get forgotten about and left to the last minute.

In this workshop you will learn how to use thermal simulation to identify thermal issues early in the design process. You will discover how to import PCB designs from your EDA software in to a 6SigmaET thermal simulation, how to accurately model components on your board and how to use simulation results to improve a systems thermal management. Using simulation helps you eliminate thermal issues and streamline your design process. 

In this session, delegates will learn

1.    How thermal simulation help identify and resolve thermal issues in electronics

2.    How to create thermal simulation from concept to final design

3.    How heat transfer through a PCB

4.    How to Import PCB designs from your EDA software into a 6SigmaET thermal simulation

5.    How to accurately model electronic components in a thermal simulation

Workshop Theatre 2

Smart Solutions for Complex Machines. A Molex presentation sponsored by Mouser

Room: Workshop Theatre 2

Jeff Barnes, Distribution Corporate Account Manager – Industrial Europe, Molex

The manufacturing industry is evolving from simple wiring to sophisticated solutions in order to optimise manufacturing capabilities. As such, advanced modular technologies are instrumental in simplifying and making highly complex industrial machines and robotics more intelligent, functional and connected. Modular connectivity enables significant reductions in manufacturing times, supporting mechanical stability and performance whilst minimising downtime through continuous monitoring and faster troubleshooting. Find out how Molex’s extensive product offering is integral to this evolution in the challenging environment of Industry 4.0.  

During this session delegates will learn:

1. Common challenges facing today’s factories

2. Market trends and the evolution from simple wiring to sophisticated solutions

3. Find out more about Molex Industrial Automation Solutions 4.0 and Flexible Automation Module (FAM)

Workshop Theatre 3

Build VS Buy

Room: Workshop Theatre 3

Ron Singh, Director Channel Sales EMEA, Digi International

Build or Buy?
This workshop will navigate the decision for companies whether to outsource or for own-design. Digi International presents the pitfalls and perils of committing to a long-term embedded or RF self-build design.

During this session delegates will learn:

1. Chip-down engineering and design cost mitigation vs using a modular design

2. Speeding up the design cycle via parallel h/w & s/w product development

3. Responsibilities of maintaining the product life cycle

4. Future-proofing your design

14:30 - 15:15

Workshop Theatre 1

ICF carbon fibre reinforced compounds from AKRO-PLASTIC GmbH

Room: Workshop Theatre 1

Martyn Jocelyn, Area Sales Manager, K.D. Feddersen UK Ltd

AKRO-PLASTIC has developed ways to incorporate dry, conditioned carbon fibre fabrics into a polymer melt which can be used to reduce weight of existing thermoplastic injection moulded parts (using existing mould tools), or through design optimization can be used to replace metal components.  This has been driven by the automotive industry where fuel economy and CO2 emissions targets have sparked real competition for light weight construction. OEMs and their suppliers invest significant sums to implement new ideas, as well as ideas that have yet to be realised, in lightweight design for large-scale production.

During this session delegates will learn:

1.That ICF (Carbon Fibre) Compounds can be used to reduce weight of injection moulded parts.

2.How Mechanical Properties of ICF compounds compare with Virgin Cabron Fibre and  Glass Fibre Reinforced Compounds

3.Case Studies of award winning applications where ICF Compounds have been used to reduce weight, or for inherent electrical conductive properties

4.Processing Recommendations for Injection Moulding,

5.That further weight reductions (50% total) are possible by combining ICF with “Lite-weight” Compounds and Processing Foaming Agents developed by AKRO Plastics.

Workshop Theatre 2

When Lightning Strikes

Room: Workshop Theatre 2

Peter Scott, Engineering Director, AEF Solutions

The workshop will examine the issues that surround EMI and EMP protection and what the future had is in store.  It will help design engineers to understand the best ways to overcome design issues through a series of real world case studies and examples.

During this session, Delegates will learn:

1.      The Principles of EMI and EMP protection

2.      The importance of design solutions

3.      Principle of Operation and Technologies

4.      What the future looks like and how to prepare for it.

Workshop Theatre 3

3D-MID Prototyping using 3D-Printing

Room: Workshop Theatre 3

Manuel Martin, Product Manager 3D MID , Beta LAYOUT

Since electronic devices are becoming smaller and more precise engineers face the added challenge to develop modules which need less space and are lower in weight. The new 3D-MID (Mechatronic Integrated Devices) technology, plastic parts designed with electronic circuits, is a favourable solution and the answer to the requirements of the electronic industry for space saving modules. Three-dimensional circuit carriers enable engineers to develop multifunctional products with new features and reduced weight. 3D-MIDs are usually produced from injection moulded plastic. A new method by using 3D printing instead of moulds allows to produce MID-prototypes more economic and in less time.

During this session delegates will learn:

1. How 3D MID prototypes based on laser sintered 3D prints are manufactured and explains how this technology will now be accessible to a broad range of R&D engineers. The presentation will answer questions regarding the necessary data required for production, design rules specification and manufacturing processes.

15:30 - 16:15

Workshop Theatre 1

Designing for Additive Manufacturing Workshop – An introduction

Room: Workshop Theatre 1

Maryam Qureshi, UK&I 3DP Applications Engineer, HP Inc

HP will be hosting an introductory session on how to design for additive manufacturing covering a brief introduction to:

  • The benefits of HP MJF Technology
  • How to identify and select the right applications for AM across your product lifecycle
  • Live customer applications / case studies to inspire you

During this session delegates will learn:

1. The benefits of HP MJF technology and how HP has used this technology itself to;
- Accelerate time to market
- Drive down costs
- Deliver quality parts.

2.  An introduction to designing for AM and how to identify and select the right applications for AM .

Workshop Theatre 2

The ideal filter in just 6 steps

Room: Workshop Theatre 2

Herbert Blum, Product Manager, SCHURTER

The causes of EMC interference can be of various kinds. Therefore, standard filters are not always the simplest and best solution. SCHURTER now offers an "Evaluation Board" with which an almost ideal filter for the specific incident can be built within a short time in an iterative process.

Course shows how to select the right EMC filter components and how they perform under EMI noise in a real situation of a switching power supply. A step-by-step process to find the ideal filter.

During this session delegates will learn:

1. Performance of capacitors and inductors in real EMI noise situation

2. How to set up a filter with passive components on PCB

3. How to select the right component or filter

4. Prepare the system for EMC measurements

Workshop Theatre 3

Capacitance – Tip of an Iceberg

Room: Workshop Theatre 3

Gopi Patel, Field Applications Engineer , Wurth Electronics

Lots of SMPS blow up, some encounter EMC failures and several MCU glitches could be related to how well the capacitance is distributed on the circuit. They depend upon type, material and manufacturing. There’s also Q-factor, ESR, ESL, DF, Ripple current, Temperature rise, electrical stress, DC bias, and SRF. WE will discuss formulas, simulations and the best way to find the right capacitor, where the industry is heading Electrolytic, Polymer, MLCC, Hybrid, Film, SuperCap, and HChip or does size really matter? Come and join us to get full capacity out of your capacitors. 

During this session delegates will learn:
1. How to identify right capacitor using REDEXPERT
2. Formulas to anticipate life of a capacitor
3. Age enhancing techniques
4. More than just Farads and Voltage rating
5. Unwritten rules for success in electronics industry

10:30 - 11:15

Workshop Theatre 1

Next generation solutions for fluid power replacement

Room: Workshop Theatre 1

Bruno Haaser, Business Development Manager High Performance Actuators, SKF Motion Technologies

Fluid power replacement workshop, to give basic guidance on moving from fluid-powered to electro-actuated linear solutions, with a deep look on high power density solutions and the next generation of compact electro-mechanical cylinder. This next generation is an ideal solution when compactness and high productivity are needed, and with upcoming IoT & 4.0 option to provide the best performances following market needs and trends on predictive maintenance.

During this session delegates will learn:

1. Pro and cons of electro-mechanical systems vs fluid powered ones

2. Insights to correctly select and size electro-mechanical actuator for a defined application

3. Next generation of compact electro-mechanical cylinder, for extreme power density in operation

4. IoT and 4.0 trends on electro-mechanical cylinders

Workshop Theatre 2

µModules, an Analog presentation, sponsored by Mouser Electronics

Room: Workshop Theatre 2

Diarmuid Carey, Senior Applications Engineer, Analog Devices

With shorter design cycles and shrinking board space, designers have less time to complete their system design. Power supply design is already a challenge to get right when enough time is allowed. µModules greatly simplify the design allowing for increased power density while still achieving great thermals. Adding good EMI performance as a requirement into the mix can result in compromises that you as a system designer cannot allow for. Our new range of low noise µModules can help produce a low noise output that is quiet enough to power sensitive downstream loads.

During this session delegates will learn:

1. What a µModule is and some examples of where these devices are used.

2. How µModules can simplify your system power tree and save design time and PCB area

3. What resources are provided with each µModule release and the available support from ADI.

4. How low noise requirements are more widespread resulting in challenges for system designers.

5. About our range of low noise µModules.

Workshop Theatre 3

Samtec Products for Severe Environments

Room: Workshop Theatre 3

Terry Emerson, Micro Rugged & Power Product Manager, SAMTEC

Discussion on Samtec products designed to be used in severe environments and the methods used to prove they are capable of withstanding them.  We will also delve into carrying high speed signals (4-8 Gbps) through our already rugged products.

During this session delegates will learn:

1. How Samtec tests our products to prove they can withstand severe environments.

2. What products can be used in severe environments.

3. What Samtec products can help with carrying high speed signals in severe environments.

11:30 - 12:15

Workshop Theatre 1

Solving the challenges of electrical design to give you a driving experience like no other

Room: Workshop Theatre 1

Nuri Zughaid, Portfolio Development Executive, Siemens PLM Software

Everyone is aware that there are electronics in almost everything nowadays, and where ever you have electronics and embedded software, you also have electrical systems powering and interconnecting that electronic content.

During the presentation Nuri will talk about the challenges of electrical complexity and how Siemens solutions can address these issues.

During this session delegates will learn:

1. How increased product complexity can have a severe impact on business

2. How to manage the complexity of electrical and harness design and mechanical integration

3. How the Digital Twin will improve design collaboration, save time and reduce cost

Workshop Theatre 2

Defining High Speed Signal Paths in modern PCB

Room: Workshop Theatre 2

Sten Inversen, Field Application Engineer, Altium

With ever-increasing device switching speeds comes the challenge of maintaining the integrity of the signal, and meeting timing requirements. The signal integrity can be managed through controlled impedance routing, which is achieved through careful design of both the PCB stack-up and routing widths.

The timing requirements are met by matching the routed lengths of the signal paths. For a set of 2-pin signal paths, calculating and comparing the lengths is a straightforward process. This is not the case for many typical designs though, where there may be a series termination component, and more than 2 pins in the signal path.

During this session delegates will learn:

1. Impedance controlled PCB stack-up and Back drill vias using Altium Layer stack manager.

2. Length matching using Altium X-signal.

3. Technology aware length matching Wizard in Altium.

Workshop Theatre 3

Trust Platform for the Microchip CryptoAuthentication™️ Family

Room: Workshop Theatre 3

Rob Graham, Senior Field Applications Engineer , Microchip

12:30 - 13:15

Workshop Theatre 1

From Design to Print: Thoughts on the End to End Workflow for Additive Layer Manufacturing

Room: Workshop Theatre 1

Stuart Nixon, SIMULIA EuroNorth Senior Solution Consultant, Dassault Systemes

Additive Layer Manufacturing (ALM) promises a paradigm shift in engineering, with new ways to imagine and realise product design. The flexibility offered by the solution has sparked a rich development cycle, investigating processing conditions, material architectures, but also new fields in design, CAD and simulation. There are many disjointed tools available that offer point solutions to particular problems within the ALM workflow. This in itself generates its own problems of data management, synchronisation and tractability. The purpose of this session is to review a different approach to solve the problem.

During this session delegates will learn:

1. Challenges within the ALM sphere

2.  The role of functional design for ALM

3. Simulation requirements for ALM

4. Issues with point solutions over an integrated environment

5. Process optimisation

Workshop Theatre 2

How to maximise PCB space with connector selection

Room: Workshop Theatre 2

John Brunt, Product Manager High Reliability Connectors, Harwin

Connectors are often the last components considered during PCB design, yet they account for a considerable amount of PCB space and a large percentage of the overall B.O.M. value. When specified in the right way, the resulting saving in PCB space can be significant.

We will investigate the common connector selection mistakes and how they can be avoided, as well as providing practical tips on selecting the right connector for the job.

During this session delegates will learn:

1.Common connector selection mistakes and their implications

2. Connector selection done right – the advantages

3. Key considerations

4. A connector specifiers checklist

Workshop Theatre 3

Industrial removable memory devices, their benefits over USB and SD, and how to design them into an embedded system

Room: Workshop Theatre 3

Richard Warrilow, Technical Author, Nexus Industrial Memory

Datakey’s industrial removable memory devices pre-date USB and SD and are used in a variety of harsh environment and high security applications; in sectors that include defence, medical, transportation, industrial automation and renewable energies. As with commercial USB and SD, devices can be used for data transfer and storage, user authentication and as a means of implementing software and firmware upgrades. Where they score over USB is in terms of durability, ruggedness and security. Also, long-term availability is assured. This is a not-to-be-missed workshop, given by Datakey’s exclusive distributor in the UK, Ireland, Germany, Switzerland, Austria and Scandinavia.

During this session delegates will learn:

1. How to gauge your system-level requirements for removable memory devices

2. How to assure system longevity through appropriate device form factor selection

3. How to reduce security risks

4. How to connect electrically with Datakey removable memory devices

5. How to communicate with Datakey removable memory devices

13:30 - 14:15

Workshop Theatre 1

Going Beyond Simulation in CAD with Brompton Bicycle

Room: Workshop Theatre 1

Joyce Tang, Application Engineer, Altair Engineering Ltd

As an attendee to Engineering Design Show, we would like to invite you to an exciting and unique design showcase from Altair and Brompton Bicycle. Taking place during the show, the session will demonstrate how the iconic company is going beyond simulation within its CAD system to inject innovation into its design process.

Join us and see first-hand how Brompton Bicycle's design team is utilising simulation technologies to 'Design the Difference' by accessing optimisation technology within Altair Inspire, a simulation suite built specifically for designers. See how Altair Inspire can accurately capture complex mechanical behaviour to verify CAD models in seconds, save weight & cost and assess manufacturability; all while being fully integrated with existing CAD systems to compliment your workflow.

Workshop Theatre 2

Storage Solutions 100% Targeting the Industrial Sector

Room: Workshop Theatre 2

Mike Kreiten, Business Development Manager, ATP Electronics

The Industrial market is complex, involving a wide variety of applications and industries with different requirements for product types across form factors, endurance ranges, usage cases, regulations, compliance, long term supply, and performance.

 ATP has been serving this challenging sector for nearly three decades, culminating in our market position as a “Industrial Only” memory & storage solutions provider

During this session delegates will learn:

1. How ATP’s “ Industrial Only “ mindset & focus delivers the best TCO value with longevity and higher endurance for industrial applications

2. What is full in-house process ownership ? and why is it important for industrial focused memory & storage solutions provider to possess this feature

3. Why extensive screening & testing is fundamental for memory & storage solutions targeting the industrial sector

Workshop Theatre 3

Press-Fit Technology For High Current Applications

Room: Workshop Theatre 3

Javier Carnero, Field Applications Engineer , Wurth Electronics

During the workshop delegates will be able to learn the basic principles of Press Fit technology for High Current applications including performance and reliability of the connection from a PCB point of view. We will be looking closely and the different points that makes Red Cube an outstanding solution to carry high current and also what it makes it so stable on the PCB against THT process.

During this session delegates will learn:

1. Overview of Press Fit Technology for high current applications

2. Mechanical and Electrical Properties of press fit

3. Advantages of press fit vs conventional THT

4. Comparison against other press fit solutions

5. PCB Requirements for press fit process

14:30 - 15:15

Workshop Theatre 1

TBC

Room: Workshop Theatre 1

Details coming soon

Workshop Theatre 2

Designing for Additive Manufacturing Workshop – An introduction

Room: Workshop Theatre 2

Maryam Qureshi, UK&I 3DP Applications Engineer, HP Inc

HP will be hosting an introductory session on how to design for additive manufacturing covering a brief introduction to:

The benefits of HP MJF Technology
How to identify and select the right applications for AM across your product lifecycle
Live customer applications / case studies to inspire you

During this session delegates will learn:

1. The benefits of HP MJF technology and how HP has used this technology itself to;
- Accelerate time to market
- Drive down costs
- Deliver quality parts.

2.  An introduction to designing for AM and how to identify and select the right applications for AM .

Workshop Theatre 3

Smart Buildings - Hospital use case connecting numerous IoT Solutions to increase efficiency

Room: Workshop Theatre 3

Dennis van Doorn, Marketing Manager, Fujitsu Components

Return on Investment in Smart Buildings, absolutely!

By analyzing work processes and implementing IoT accordingly, it is possible to minimize labor costs or improve effectiveness, lower carbon footprints and improve visitor/ patient/ staff well-being.

The UMC Utrecht hospital use case:
The Dutch University Hospital Utrecht has recently implemented Fujitsu’s IoT Connectivity Solution to improve work processes. This project aims at improving the quality of care by improving the availability and employability of medical equipment through Asset Management and to provide higher quality care.

Public buildings, office buildings, shopping centers etc. are changing their current lighting infrastructures to LED lighting. At the UMC Utrecht all LED lighting fixtures are configured as anchor nodes, and together form the mesh network, through which battery powered mobile tags communicate their positions. With Smart Lighting being mains-powered, lighting provides a very low latency network which enables the possibility to easily extend the amount of IoT applications that run on top of it.

This use case also covers the implementation of Sensors to monitor climate conditions and occupancy, smart buttons and Indoor Navigation and illustrates the necessity of scalable solutions.

During this session delegates will learn:

1. IoT implementation can provide RoI

2. What is possible by connecting solutions