Workshop Programme

Practical workshop sessions hosted by key exhibitors are held in three workshop theatres on the show floor to support your professional development. All content has been approved and accredited for CPD points by the IED.

Once you have registered you will be prompted to book your preferred sessions so you can tailor your visit to meet your personal learning and interest requirements.

10:30 - 11:15

Workshop Theatre 1

Next Generation 3D CAD from Siemens

Room: Workshop Theatre 1

Kevin Moran, Senior Applications Engineer, Siemens PLM Software

Kevin Moran will introduce the presentation on behalf of IC Blue and Siemens. The first part Kevin will introduce Siemens Synchronous Technology (ST). Kevin with then show the benefits of ST with use cases such as Generative Design, Reuse of CAD data and Reverse Engineering.

 DURING THIS SESSION DELEGATES WILL LEARN:

1. What Siemens Synchronous Technology (ST) is.
2. How ST enables reuse of CAD data?
3. How ST is the best of both Parametric and Direct modelling
4. What is new in Siemens Solid Edge 2020?

Workshop Theatre 2

Altium

Room: Workshop Theatre 2

Sten Inversen, Field Application Engineer, Altium

With ever-increasing device switching speeds comes the challenge of maintaining the integrity of the signal, and meeting timing requirements. The signal integrity can be managed through controlled impedance routing, which is achieved through careful design of both the PCB stack-up and routing widths.

The timing requirements are met by matching the routed lengths of the signal paths. For a set of 2-pin signal paths, calculating and comparing the lengths is a straightforward process. This is not the case for many typical designs though, where there may be a series termination component, and more than 2 pins in the signal path.

 During this session delegates will learn:

1. Impedance controlled PCB stack-up and Back drill vias using Altium Layer stack manager.

2. Length matching using Altium X-signal.

3. Technology aware length matching Wizard in Altium.

Workshop Theatre 3

COMSOL

Room: Workshop Theatre 3

Dr Richard Chippendale, Technical Manager, COMSOL

Numerical simulations allow us to directly visualize physical processes occurring within products. This provides an insight into the interaction of otherwise invisible phenomena, such as the movement of heat or mechanical stress.

During the early stages of product design, you will tend to have significant freedom within a given design envelope. With numerical simulation tools you can efficiently and systematically investigate this design envelope to create an optimized product. This could be achieved by changing the dimensions, shape, or form of the design, to minimize material use for example; or by considering different, cheaper materials, or even by simulating and optimizing the manufacturing process to minimize defects in the end product.

DURING THIS SESSION DELEGATES WILL LEARN:
  1. How to optimize engineering designs using Optimization module within the COMSOL Multiphysics® software
  2. How simulation workflow can be generalized to many branches of physics and engineering
  3. How the optimized geometry can be exported for further analysis and 3D printing

11:30 - 12:15

Workshop Theatre 1

Ansys - Design Optimisation with ANSYS

Room: Workshop Theatre 1

Vishal Sharma, Senior Application Engineer, ANSYS UK

Topology optimisation, a technique used to generate free-form geometries is explored in this session. Additive Manufacturing (3D Printing) is gaining traction in the manufacturing industry, we will explore the opportunities this brings, but also the challenges. We’ll learn how simulation assisted design can help tackle these problems and produce components that are lightweight but strong enough to withstand the most rigorous of conditions.

1. What topology optimisation is
2. Different optimisation techniques
3. How to run a topology optimisation in ANSYS
4. How to validate optimised designs

Workshop Theatre 2

Hamamatsu: Implementing Disruptive Mid-Infrared Technologies in Gas Sensing Applications

Room: Workshop Theatre 2

Adnan Quazi, Sales Engineer, Hamamatsu Photonics

Indium Arsenide Antimonite detectors provide an exciting new prospect for being able to detect gas species in various scenarios. However with any new technology, understanding how to properly implement it is necessary to be able to get the maximum value. We will highlight the flaws of looking at D* as a measure of sensitivity and instead focus on Signal to Noise Ratio.
We will focus on demystifying the electronic differences in this type of photo-voltaic detector technology. How it may be used in conjunction with different mid-infrared sources (LEDs and Quantum Cascade Lasers) and tips and tricks to maximise SNR.

DURING THIS SESSION DELEGATES WILL LEARN:

1. InAsSb Detectors, MIR LEDs and QCLs: Technology Overview

2. InAsSb Detectors, MIR LEDs and QCLs: Market comparison

3. The different operational modes of InAsSb. When to use which.

4. Why D* does not tell the full story and how to appreciate SNR

5. Tips and tricks to improve SNR with InAsSb Detectors.

Workshop Theatre 3

Toby Electronics - Samtec Products for Severe Environments

Room: Workshop Theatre 3

Terry Emerson, Micro Rugged & Power Product Manager, SAMTEC

Discussion on Samtec products designed to be used in severe environments and the methods used to prove they are capable of withstanding them.  We will also delve into Samtec’s Micro Rugged product line and discuss different options for interconnects and cables to solve system design obstacles.

1. How Samtec tests our products to prove they can withstand severe environments.
2. What products can be used in severe environments.
3. How Samtec products can help with complex design obstacles.

12:30 - 13:15

Workshop Theatre 1

Marketing and Social media in China

Room: Workshop Theatre 1

Gordon Wong, Director, Techworks Asia

Claire Walker, Director, Techworks Asia

The opportunities to penetrate the Greater China market are plentiful and financially attractive for tech companies. Whether you have an established infrastructure in China, or are still looking to start targeting this vast market, this session will look at key trends and drivers and provide insights into which marketing initiatives work best in the fast-moving tech sector. We’ll look at how a marketing programme needs to harness both traditional and social key influencers to deliver messaging to its audience across the region, and analyse which approaches work most effectively. Particular focus will be made on the electronics design sector.

During this session delegates will learn:

1. How best to engage with key China media and influencers.

2. Why social media is vital for B2B in China.

3. What PR and marketing approaches to avoid.

4. What rewards are available for tech companies willing to commit to a long-term plan.

5. How best to align with the China Government’s key high-level technology target sectors and strands.

Workshop Theatre 2

Create Effective Cooling Solutions Using SOLIDWORKS® Flow Simulation and the 3DEXPERIENCE® Platform

Room: Workshop Theatre 2

Mattias Robertsson, Senior Solution Consultant, Simulation, Dassault Systemes

Ian Pilkington, 3DExperience Senior Business Development Executive, Dassault Systemes

With SOLIDWORKS® Flow Simulation engineers can virtually test designs to assess effectiveness of their cooling solution directly in the 3D CAD model. SOLIDWORKS dedicated thermal management study simulation tools enable accurate thermal analysis of electronic PCB and enclosure design. Using SOLIDWORKS Simulation, engineers can reduce noise, choose and test different cooling options and save time and money instead of building multiple prototypes and conducting thermal camera studies. Cloud-based 3DEXPERIENCE® platform allows companies to integrate all pieces of the product development lifecycle - from design to simulation and manufacturing - into one seamless workflow to enable better-connected teams and more-agile processes.

DURING THIS SESSION DELEGATES WILL LEARN HOW TO:

1. Virtually test CAD models, speed up innovation and reduce time to market with SOLIDWORKS Simulation

2. Easily visualise and solve thermal design requirements with SOLIDWORKS Flow Simulation

3.  Remove heat and noise from electronics and optimize their designs

4.  Seamlessly collaborate with all key stakeholders using the 3DEXPERIENCE® platform

Workshop Theatre 3

On-Device AI with Qualcomm Snapdragon

Room: Workshop Theatre 3

Dominik Bohn, Business Development Manager , BCD-Atlantik Ltd

Artificial Intelligence and Artificial Neural Networks require complex software algorithms and extremely high computational power, this is covered with the increased performance of the latest Snapdragon products.

The latest Snapdragon products have an internal Neural Processing Engine (SNP), which brings a significant performance boost over the pure calculation in the CPU / GPU via parallelization of the calculations. Corresponding software, such as Dronecode, Robot Operating System or the Snapdragon Neural Processing Engine SDK now allow companies with limited development resources to deploy these technologies and execute trained AI models on their devices, without the need for a cloud connection (edge computing).

During this session delegates will learn:

1. Comparison of on-device AI and Cloud AI

2. Hardware: Power and Efficiency considerations 

3. AI Tools for development and deployment

4. System Efficiency and Reliability considerations

13:30 - 14:15

Workshop Theatre 1

TBC

Room: Workshop Theatre 1

Details coming soon

Workshop Theatre 2

Smart Solutions for Complex Machines. A Molex presentation sponsored by Mouser

Room: Workshop Theatre 2

Jeff Barnes, Distribution Corporate Account Manager – Industrial Europe, Molex

The manufacturing industry is evolving from simple wiring to sophisticated solutions in order to optimise manufacturing capabilities. As such, advanced modular technologies are instrumental in simplifying and making highly complex industrial machines and robotics more intelligent, functional and connected. Modular connectivity enables significant reductions in manufacturing times, supporting mechanical stability and performance whilst minimising downtime through continuous monitoring and faster troubleshooting. Find out how Molex’s extensive product offering is integral to this evolution in the challenging environment of Industry 4.0.  


1. Common challenges facing today’s factories
2. Market trends and the evolution from simple wiring to sophisticated solutions
3. Find out more about Molex Industrial Automation Solutions 4.0 and Flexible Automation Module (FAM)

Workshop Theatre 3

Microsemi Polarfire FPGA System Solutions

Room: Workshop Theatre 3

Chris Bowers, Field Application Engineer , Solid State Supplies Ltd / Microchip

The award-winning PolarFire FPGAs deliver the industry’s lowest power at mid-range densities with exceptional security and reliability. The product family spans from 100K logic elements (LEs) to 500K LEs, features 12.7G transceivers and offers up to 50% lower power than competing mid-range FPGAs. The devices are ideal for a wide range of applications, within wireline access networks and cellular infrastructure, defence and commercial aviation markets, as well as industrial automation and IoT markets. The workshop will give details of the device architecture design flow and systems solutions.

During this session delegates will learn:

1. Cost optimised architecture

2. Power optimisation

3. Integrated I.P.

4. 3rd party I.P.

5. Transceiver optimisation

14:30 - 15:15

Workshop Theatre 1

KD Feddersen

Room: Workshop Theatre 1

Martyn Jocelyn, Area Sales Manager, K.D. Feddersen UK Ltd

ICF carbon fibre reinforced compounds from AKRO-PLASTIC GmbH

AKRO-PLASTIC has developed ways to incorporate dry, conditioned carbon fibre fabrics into a polymer melt which can be used to reduce weight of existing thermoplastic injection moulded parts (using existing mould tools), or through design optimization can be used to replace metal components.  This has been driven by the automotive industry where fuel economy and CO2 emissions targets have sparked real competition for light weight construction. OEMs and their suppliers invest significant sums to implement new ideas, as well as ideas that have yet to be realised, in lightweight design for large-scale production.

During this session delegates will learn

1.That ICF (Carbon Fibre) Compounds can be used to reduce weight of injection moulded parts.

2.How Mechanical Properties of ICF compounds compare with Virgin Cabron Fibre and  Glass Fibre Reinforced Compounds

3.Case Studies of award winning applications where ICF Compounds have been used to reduce weight, or for inherent electrical conductive properties

4.Processing Recommendations for Injection Moulding,

5.That further weight reductions (50% total) are possible by combining ICF with “Lite-weight” Compounds and Processing Foaming Agents developed by AKRO Plastics.

Workshop Theatre 2

AEF Solutions / Espirit

Room: Workshop Theatre 2

Peter Scott, Engineering Director, AEF Solutions

Details coming soon

Workshop Theatre 3

Beta Layout

Room: Workshop Theatre 3

Details coming soon

15:30 - 16:15

Workshop Theatre 1

Designing for Additive Manufacturing Workshop – An introduction

Room: Workshop Theatre 1

Maryam, UK&I 3DP Applications Engineer, HP Inc

HP will be hosting an introductory session on how to design for additive manufacturing covering a brief introduction to:

  • The benefits of HP MJF Technology
  • How to identify and select the right applications for AM across your product lifecycle
  • Live customer applications / case studies to inspire you

During this session delegates will learn 

1. The benefits of HP MJF technology and how HP has used this technology itself to;
- Accelerate time to market
- Drive down costs
- Deliver quality parts.
2.  An introduction to designing for AM and how to identify and select the right applications for AM .

Workshop Theatre 2

SCHURTER - The ideal filter in just 6 steps

Room: Workshop Theatre 2

Herbert Blum, Product Manager, SCHURTER

The causes of EMC interference can be of various kinds. Therefore, standard filters are not always the simplest and best solution. SCHURTER now offers an "Evaluation Board" with which an almost ideal filter for the specific incident can be built within a short time in an iterative process.

Course shows how to select the right EMC filter components and how they perform under EMI noise in a real situation of a switching power supply. A step-by-step process to find the ideal filter.

1. Performance of capacitors and inductors in real EMI noise situation
2. How to set up a filter with passive components on PCB
3. How to select the right component or filter
4. Prepare the system for EMC measurements

Workshop Theatre 3

Capacitance – Tip of an Iceberg - Wurth Elektronic

Room: Workshop Theatre 3

Gopi Patel, Field Applications Engineer , Wurth Electronics

Lots of SMPS blow up, some encounter EMC failures and several MCU glitches could be related to how well the capacitance is distributed on the circuit. They depend upon type, material and manufacturing. There’s also Q-factor, ESR, ESL, DF, Ripple current, Temperature rise, electrical stress, DC bias, and SRF. WE will discuss formulas, simulations and the best way to find the right capacitor, where the industry is heading Electrolytic, Polymer, MLCC, Hybrid, Film, SuperCap, and HChip or does size really matter? Come and join us to get full capacity out of your capacitors. 

DURING THIS SESSION DELEGATES WILL LEARN:

  1. How to identify right capacitor using REDEXPERT
  2. Formulas to anticipate life of a capacitor
  3. Age enhancing techniques
  4. More than just Farads and Voltage rating
  5. Unwritten rules for success in electronics industry

10:30 - 11:15

Workshop Theatre 1

Next generation solutions for fluid power replacement

Room: Workshop Theatre 1

Bruno Haaser, Business Development Manager High Performance Actuators, SKF Motion Technologies

Fluid power replacement workshop, to give basic guidance on moving from fluid-powered to electro-actuated linear solutions, with a deep look on high power density solutions and the next generation of compact electro-mechanical cylinder. This next generation is an ideal solution when compactness and high productivity are needed, and with upcoming IoT & 4.0 option to provide the best performances following market needs and trends on predictive maintenance.

During this session delegates will learn:
1. Pro and cons of electro-mechanical systems vs fluid powered ones
2. Insights to correctly select and size electro-mechanical actuator for a defined application
3. Next generation of compact electro-mechanical cylinder, for extreme power density in operation
4. IoT and 4.0 trends on electro-mechanical cylinders

Workshop Theatre 2

µModules, an Analog presentation, sponsored by Mouser Electronics

Room: Workshop Theatre 2

Diarmuid Carey, Senior Applications Engineer, Analog Devices

With shorter design cycles and shrinking board space, designers have less time to complete their system design. Power supply design is already a challenge to get right when enough time is allowed. µModules greatly simplify the design allowing for increased power density while still achieving great thermals. Adding good EMI performance as a requirement into the mix can result in compromises that you as a system designer cannot allow for. Our new range of low noise µModules can help produce a low noise output that is quiet enough to power sensitive downstream loads.

DURING THIS SESSION DELEGATES WILL LEARN:

1. What a µModule is and some examples of where these devices are used.
2. How µModules can simplify your system power tree and save design time and PCB area
3. What resources are provided with each µModule release and the available support from ADI.
4. How low noise requirements are more widespread resulting in challenges for system designers.
5. About our range of low noise µModules.

Workshop Theatre 3

Toby Electronics

Room: Workshop Theatre 3

Details coming soon

11:30 - 12:15

Workshop Theatre 1

IC Blue - Bowler - Solving the challenges of electrical design to give you a driving experience like no other

Room: Workshop Theatre 1

Bowler is proud to have been the UK pioneer of Rally Raid racing cars and since become a market leader in the design and production of high performance cars with some of the most innovative, durable and exciting all-terrain vehicles ever seen. Hear how Bowler’s road car and specialist vehicle engineering and R&D team design and produce these robust and reliable performance machines.

The electronic and software content of a vehicle has increased hugely and this requires complex electrical systems powering and interconnecting that content. Hear how Siemens are helping to solve the challenges of electrical design.

1. How Bowler have become a world leader in high performance all terrain cars for road and race

2. How Siemens digital engineering platform can help solve the challenges of electrical design

Workshop Theatre 2

Defining High Speed Signal Paths in modern PCB

Room: Workshop Theatre 2

Sten Inversen, Field Application Engineer, Altium

With ever-increasing device switching speeds comes the challenge of maintaining the integrity of the signal, and meeting timing requirements. The signal integrity can be managed through controlled impedance routing, which is achieved through careful design of both the PCB stack-up and routing widths.

The timing requirements are met by matching the routed lengths of the signal paths. For a set of 2-pin signal paths, calculating and comparing the lengths is a straightforward process. This is not the case for many typical designs though, where there may be a series termination component, and more than 2 pins in the signal path.

During this session delegates will learn:

1. Impedance controlled PCB stack-up and Back drill vias using Altium Layer stack manager.

2. Length matching using Altium X-signal.

3. Technology aware length matching Wizard in Altium.

Workshop Theatre 3

Build VS Buy

Room: Workshop Theatre 3

Ron Singh, Director Channel Sales EMEA, Digi International

Build or Buy?
This workshop will navigate the decision for companies whether to outsource or for own-design. Digi International presents the pitfalls and perils of committing to a long-term embedded or RF self-build design.

1. Chip-down engineering and design cost mitigation vs using a modular design
2. Speeding up the design cycle via parallel h/w & s/w product development
3. Responsibilities of maintaining the product life cycle
4. Future-proofing your design

12:30 - 13:15

Workshop Theatre 1

From Design to Print: Thoughts on the End to End Workflow for Additive Layer Manufacturing

Room: Workshop Theatre 1

Stuart Nixon, SIMULIA EuroNorth Senior Solution Consultant, Dassault Systemes

Additive Layer Manufacturing (ALM) promises a paradigm shift in engineering, with new ways to imagine and realise product design. The flexibility offered by the solution has sparked a rich development cycle, investigating processing conditions, material architectures, but also new fields in design, CAD and simulation. There are many disjointed tools available that offer point solutions to particular problems within the ALM workflow. This in itself generates its own problems of data management, synchronisation and tractability. The purpose of this session is to review a different approach to solve the problem.

During this session delegates will learn:

1. Challenges within the ALM sphere

2.  The role of functional design for ALM

3. Simulation requirements for ALM

4. Issues with point solutions over an integrated environment

5. Process optimisation

Workshop Theatre 2

Harwin

Room: Workshop Theatre 2

Details coming soon

Workshop Theatre 3

Nexus

Room: Workshop Theatre 3

Details coming soon

13:30 - 14:15

Workshop Theatre 1

TBC

Room: Workshop Theatre 1

Details coming soon

Workshop Theatre 2

TBC

Room: Workshop Theatre 2

Details coming soon

Workshop Theatre 3

Press-Fit Technology For High Current Applications - Wurth Elektronic

Room: Workshop Theatre 3

Javier Carnero, Field Applications Engineer , Wurth Electronics

During the workshop delegates will be able to learn the basic principles of Press Fit technology for High Current applications including performance and reliability of the connection from a PCB point of view. We will be looking closely and the different points that makes Red Cube an outstanding solution to carry high current and also what it makes it so stable on the PCB against THT process.

DURING THIS SESSION DELEGATES WILL LEARN:

  1. Overview of Press Fit Technology for high current applications
  2. Mechanical and Electrical Properties of press fit
  3. Advantages of press fit vs conventional THT
  4. Comparison against other press fit solutions
  5. PCB Requirements for press fit process

14:30 - 15:15

Workshop Theatre 1

TBC

Room: Workshop Theatre 1

Details coming soon

Workshop Theatre 2

When Lightening Strikes presented by AEF

Room: Workshop Theatre 2

The workshop will examine the issues that surround EMI and EMP protection and what the future had is in store.  It will help design engineers to understand the best ways to overcome design issues through a series of real world case studies and examples.

Delegates will learn:
1.      The Principles of EMI and EMP protection
2.      The importance of design solutions
3.      Principle of Operation and Technologies
4.      What the future looks like and how to prepare for it.

Workshop Theatre 3

TBC

Room: Workshop Theatre 3

Details coming soon