Workshop Programme

Practical workshop sessions hosted by key exhibitors are held in three workshop theatres on the show floor to support your professional development. All content has been approved and accredited for CPD points by the IED.

Once you have registered you will be prompted to book your preferred sessions so you can tailor your visit to meet your personal learning and interest requirements.

10:30 - 11:15

Workshop Theatre 1

IC Blue

Details coming soon

Workshop Theatre 2

Altium

Sten Inversen, Field Application Engineer, Altium

With ever-increasing device switching speeds comes the challenge of maintaining the integrity of the signal, and meeting timing requirements. The signal integrity can be managed through controlled impedance routing, which is achieved through careful design of both the PCB stack-up and routing widths.

The timing requirements are met by matching the routed lengths of the signal paths. For a set of 2-pin signal paths, calculating and comparing the lengths is a straightforward process. This is not the case for many typical designs though, where there may be a series termination component, and more than 2 pins in the signal path.

 During this session delegates will learn:

1. Impedance controlled PCB stack-up and Back drill vias using Altium Layer stack manager.

2. Length matching using Altium X-signal.

3. Technology aware length matching Wizard in Altium.

Workshop Theatre 3

11:30 - 12:15

Workshop Theatre 1

Ansys

Details coming soon

Workshop Theatre 2

Hamamatsu

Details coming soon

Workshop Theatre 3

Toby Electronics

Details coming soon

12:30 - 13:15

Workshop Theatre 1

Marketing and Social media in China

Gordon Wong, Director, Techworks Asia

Claire Walker, Director, Techworks Asia

The opportunities to penetrate the Greater China market are plentiful and financially attractive for tech companies. Whether you have an established infrastructure in China, or are still looking to start targeting this vast market, this session will look at key trends and drivers and provide insights into which marketing initiatives work best in the fast-moving tech sector. We’ll look at how a marketing programme needs to harness both traditional and social key influencers to deliver messaging to its audience across the region, and analyse which approaches work most effectively. Particular focus will be made on the electronics design sector.

During this session delegates will learn:

1. How best to engage with key China media and influencers.

2. Why social media is vital for B2B in China.

3. What PR and marketing approaches to avoid.

4. What rewards are available for tech companies willing to commit to a long-term plan.

5. How best to align with the China Government’s key high-level technology target sectors and strands.

Workshop Theatre 2

TBC

Details coming soon

Workshop Theatre 3

On-Device AI with Qualcomm Snapdragon

Dominik Bohn, Business Development Manager , BCD-Atlantik Ltd

Artificial Intelligence and Artificial Neural Networks require complex software algorithms and extremely high computational power, this is covered with the increased performance of the latest Snapdragon products.

The latest Snapdragon products have an internal Neural Processing Engine (SNP), which brings a significant performance boost over the pure calculation in the CPU / GPU via parallelization of the calculations. Corresponding software, such as Dronecode, Robot Operating System or the Snapdragon Neural Processing Engine SDK now allow companies with limited development resources to deploy these technologies and execute trained AI models on their devices, without the need for a cloud connection (edge computing).

During this session delegates will learn:

1. Comparison of on-device AI and Cloud AI

2. Hardware: Power and Efficiency considerations 

3. AI Tools for development and deployment

4. System Efficiency and Reliability considerations

13:30 - 14:15

Workshop Theatre 1

TBC

Details coming soon

Workshop Theatre 2

TBC

Details coming soon

Workshop Theatre 3

Microsemi Polarfire FPGA System Solutions

Chris Bowers, Field Application Engineer , Solid State Supplies Ltd / Microchip

The award-winning PolarFire FPGAs deliver the industry’s lowest power at mid-range densities with exceptional security and reliability. The product family spans from 100K logic elements (LEs) to 500K LEs, features 12.7G transceivers and offers up to 50% lower power than competing mid-range FPGAs. The devices are ideal for a wide range of applications, within wireline access networks and cellular infrastructure, defence and commercial aviation markets, as well as industrial automation and IoT markets. The workshop will give details of the device architecture design flow and systems solutions.

During this session delegates will learn:

1. Cost optimised architecture

2. Power optimisation

3. Integrated I.P.

4. 3rd party I.P.

5. Transceiver optimisation

14:30 - 15:15

Workshop Theatre 1

KD Feddersen

Details coming soon

Workshop Theatre 2

AEF Solutions / Espirit

Details coming soon

Workshop Theatre 3

Beta Layout

Details coming soon

15:30 - 16:15

Workshop Theatre 1

HP

Details coming soon

Workshop Theatre 2

TBC

Details coming soon

Workshop Theatre 3

Wurth Elektronic

Details coming soon

10:30 - 11:15

Workshop Theatre 1

SKF Motion Technology

Details coming soon

Workshop Theatre 2

TBC

Details coming soon

Workshop Theatre 3

Toby Electronics

Details coming soon

11:30 - 12:15

Workshop Theatre 1

IC Blue

Details coming soon

Workshop Theatre 2

Defining High Speed Signal Paths in modern PCB

Sten Inversen, Field Application Engineer, Altium

With ever-increasing device switching speeds comes the challenge of maintaining the integrity of the signal, and meeting timing requirements. The signal integrity can be managed through controlled impedance routing, which is achieved through careful design of both the PCB stack-up and routing widths.

The timing requirements are met by matching the routed lengths of the signal paths. For a set of 2-pin signal paths, calculating and comparing the lengths is a straightforward process. This is not the case for many typical designs though, where there may be a series termination component, and more than 2 pins in the signal path.

During this session delegates will learn:

1. Impedance controlled PCB stack-up and Back drill vias using Altium Layer stack manager.

2. Length matching using Altium X-signal.

3. Technology aware length matching Wizard in Altium.

Workshop Theatre 3

12:30 - 13:15

Workshop Theatre 1

TBC

Details coming soon

Workshop Theatre 2

Harwin

Details coming soon

Workshop Theatre 3

Nexus

Details coming soon

13:30 - 14:15

Workshop Theatre 1

TBC

Details coming soon

Workshop Theatre 2

TBC

Details coming soon

Workshop Theatre 3

Wurth Elektronic

Details coming soon

14:30 - 15:15

Workshop Theatre 1

TBC

Details coming soon

Workshop Theatre 2

TBC

Details coming soon

Workshop Theatre 3

TBC

Details coming soon