Thermal Management of Electronic Devices with COMSOL®

19 October 2021 11:30 - 12:15

Interested in reducing the temperature within your product? Come along to this introductory talk to discover how with COMSOL Multiphysics® you can investigate the thermal management of your device using a numerical model.   

The design of a complete device can contain multiple electronic and/or thermal components, some of which might have thermal restrictions. Further, with the shrinking of electronic devices, there is an ever-increasing power density that requires efficient thermal management. By combining electromagnetics simulation and heat transfer analysis, insights into design requirements and improvements can be gained. This can include the visualization of the convection profile and the optimization of the size and position of vents.

1. How to improve the thermal management with numerical simulation.
2. How to set up and run a simulation in COMSOL Multiphysics®.
3. How simulation apps can be used to extend the use of simulation beyond the "specialist”.

Arno Dubois, Applications Engineer, COMSOL